| 标题 |
Effect of anisotropic grain growth on improving the bonding strength of -oriented nanotwinned copper films |
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| 其它 |
期刊:Materials Science and Engineering: A 作者:Shih-Yang Chang; Yi-Cheng Chu; K.N. Tu; Chih Chen 出版日期:2021-02-01 |
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(2025-6-4)