| 标题 |
Reflow profile simulation by finite element method for a BGA package |
| 网址 | |
| DOI | |
| 其它 |
期刊:2005 6th International Conference on Electronic Packaging Technology 作者:Shen Liang; Wang Mingxiang; He YongHong; Lam Tim Fai; Jiang Yu Qi 出版日期:暂无 |
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(2025-6-4)