| 标题 |
Investigations on the interfacial diffusion and friction temperature during Cu-Cu ultrasonic bonding by molecular dynamics simulation |
| 网址 | |
| DOI | |
| 其它 |
期刊:Tribology International 作者:Zhao Li; Wenchao Tian; L. Bai; Zhiqiang Chen; Yongkun Wang 出版日期:2026-01-01 |
| 求助人 | |
| 下载 |
PDF的下载单位、IP信息已删除
(2025-6-4)