| 标题 |
 Layer-by-layer assembly of boron arsenide and copper nanoflake-based aramid nanofibers for thermoconductive electromagnetic interference shielding materials with superior mechanical flexibility and flame retardancy |
| 网址 | |
| DOI | |
| 其它 |
期刊：Journal of Industrial and Engineering Chemistry 作者：Van Cuong Nguyen; Vi Nguyen Pham; Chi Thien Nguyen; Le Hoang Ai Pham; Duy Khiem Nguyen; et al 出版日期：2024 |
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(2025-6-4)
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