| 标题 |
Surface modification of polyimide film by coupling reaction for copper metallization |
| 网址 | |
| DOI | |
| 其它 |
期刊:Journal of Industrial and Engineering Chemistry 作者:Hwa Jin Kim; Yun Jun Park; Jong-Ho Choi; Hak Soo Han; Young Taik Hong 出版日期:2009-02-25 |
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(2025-6-4)