| 标题 |
Innovative Fault Localization Techniques for ATPG Failures in Wire-Bonded BGA Packages |
| 网址 | |
| DOI |
10.31399/asm.cp.istfa2024p0135
doi
|
| 其它 |
期刊:International Symposium for Testing and Failure Analysis 作者:Lorenzo Lanzanova 出版日期:2024-10-28 |
| 求助人 | |
| 下载 |
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(2025-6-4)