| 标题 |
Twin-aware Monte Carlo simulation of microstructural evolution in copper through-silicon vias (TSVs) based on EBSD-initiated microstructures |
| 网址 | |
| DOI | |
| 其它 |
期刊:Journal of Applied Physics 作者:Zhenliang Pan; Yuchen Bao; Tiwei Wei 出版日期:2025-12-16 |
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(2025-6-4)