| 标题 |
Amorphous boron nitride as an ultrathin copper diffusion barrier for advanced interconnects |
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| DOI | |
| 其它 |
期刊:2D materials 作者:Onurcan Kaya; Hyeong-Joon Kim; Byeongkyu Kim; Thomas Galvani; LUIGI COLOMBO; et al 出版日期:2025-11-27 |
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(2025-6-4)