| 标题 |
Low-temperature Cu/SiO2 hybrid bonding based on Ar/H2 plasma and citric acid cooperative activation for multi-functional chip integration |
| 网址 | |
| DOI | |
| 其它 |
期刊:Applied Surface Science 作者:Fanfan Niu; Xiaobing Wang; Shuhan Yang; Shijiao Xu; Yuyang Zhang; et al 出版日期:2024-03-01 |
| 求助人 | |
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(2025-6-4)