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312 积分 2025-06-05 加入
Activating AlN/AlN surfaces for low-temperature ceramic bonding: argon or oxygen plasma?
1个月前
已完结
Structural characterization and bonding energy analysis for plasma-activated bonding of SiCN films: A reactive molecular dynamics study
2个月前
已完结
Recent progress in surface activated bonding for 3D and heterogeneous integration
2个月前
已完结
Chemical Bonding and Phase Diagrams in Alloy Phase Stability
2个月前
已关闭
Low-temperature Cu/SiO2 hybrid bonding based on Ar/H2 plasma and citric acid cooperative activation for multi-functional chip integration
2个月前
已完结
Room Temperature Wafer Bonding of Glass Using Aluminum Oxide Intermediate Layer
2个月前
已完结
Surface co-hydrophilization via ammonia inorganic strategy for low-temperature Cu/SiO2 hybrid bonding
2个月前
已完结
(Invited) Surface Activated Wafer Bonding; Principle and Current Status
2个月前
已关闭
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