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332 积分 2025-06-05 加入
Oxide-Free SiC-SiC Direct Wafer Bonding and Its Characterization
45分钟前
求助中
Comprehensive study of high stability AlN based solar blind MSM photodetectors with Ti/Au contacts
17天前
已完结
Void-free strong bonding of surface activated silicon wafers from room temperature to annealing at 600°C
20天前
已完结
Effect of Combined Hydrophilic Activation on Interface Characteristics of Si/Si Wafer Direct Bonding
20天前
已完结
硅基金刚石MPCVD异质外延及金刚石MSM日盲紫外探测器研究
21天前
已完结
利用a-Ge中间层实现GaAs与Si键合及热应力对键合界面的影响
23天前
已完结
基于氩离子束辐照表面活化的半导体晶片键合技术研究
23天前
已完结
InP/Si异质键合的基本理论及加工工艺研究
23天前
已完结
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