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244 积分 2025-06-05 加入
Heterogeneous Wafer Bonding Technology and Thin-Film Transfer Technology-Enabling Platform for the Next Generation Applications beyond 5G
5天前
已完结
Ultraviolet Photodetectors Based on 4H‐SiC With Honeycomb‐Like Light‐Trapping Structures
5天前
已完结
Resonant-cavity-enhanced 4H-SiC thin film MSM UV photodetectors on SiO2/Si substrates
5天前
已完结
Surface-activated ultrathin ALD Al2O3 films on Si wafers for room-temperature bonding
15天前
已完结
Effect of Ar fast atom beam irradiation on alpha-Al2O3 for surface activated room temperature bonding
1个月前
已完结
Low-temperature plasma-activated bonding of quartz and Si wafers
1个月前
已完结
Al–Cu wafer-level bonding microscopic mechanism and its strength study
1个月前
已完结
Investigation of the interface between LiNbO3 and Si fabricated via room-temperature bonding method using activated Si nano layer
1个月前
已完结
Privacy Preserving Federated Learning Using CKKS Homomorphic Encryption
1个月前
已完结
Privacy Preserving Federated Learning Using CKKS Homomorphic Encryption
1个月前
已关闭
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