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356 积分 2025-06-05 加入
Low-temperature rough-surface wafer bonding with aluminum nitride ceramics implemented by capillary and oxidation actions
47分钟前
求助中
Atomic-level contact formation between LiNbO3 and Si wafers via surface-activated bonding at room temperature
1小时前
求助中
High-vacuum Ar plasma-activated in-situ wafer bonding for low-dislocation-density Ge-on-SOI heterojunction with microcrystalline Ge interlayer
1天前
已完结
宽禁带碳化硅晶片键合研究进展（特邀）
1天前
已完结
Investigation of Au-Si eutectic wafer bonding for small-cavity MEMS devices
1天前
求助中
Atomic-level contact formation between LiNbO3 and Si wafers via surface-activated bonding at room temperature
1天前
求助中
Low-Temperature In Situ Bonding with Ion-Free Neutral Species and Ammonia-Enhanced Activation for Microfluidic Chip Architecture
15天前
已完结
Direct Bonding of 6-in. SiC/Si Wafer with Enhanced Thermal Interface
16天前
已完结
Direct Wafer Bonding of Silicon Carbide and Copper
16天前
已完结
Investigation of Si/Si bond interface fabricated by room temperature direct bonding
22天前
已完结
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