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284 积分 2025-06-05 加入
Structural characterization and bonding energy analysis for plasma-activated bonding of SiCN films: A reactive molecular dynamics study
20天前
已完结
Recent progress in surface activated bonding for 3D and heterogeneous integration
27天前
已完结
Chemical Bonding and Phase Diagrams in Alloy Phase Stability
1个月前
已关闭
Low-temperature Cu/SiO2 hybrid bonding based on Ar/H2 plasma and citric acid cooperative activation for multi-functional chip integration
1个月前
已完结
Room Temperature Wafer Bonding of Glass Using Aluminum Oxide Intermediate Layer
1个月前
已完结
Surface co-hydrophilization via ammonia inorganic strategy for low-temperature Cu/SiO2 hybrid bonding
1个月前
已完结
(Invited) Surface Activated Wafer Bonding; Principle and Current Status
1个月前
已关闭
Effects of Plasma Activation on Hydrophilic Bonding of Si and SiO[sub 2]
1个月前
已完结
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