Lv4
516 积分 2025-06-05 加入
Effect of the thermal stress on the defect evolution at GaAs/Si wafer bonding with a-Ge intermediate layer
1小时前
待确认
Influence of Post-Bonding Annealing Treatment on Interface Characteristics of Si-Si Wafer Bonded via Room Temperature Surface Activation
2小时前
已完结
Fabrication of heterogeneous LNOI photonics wafers through room temperature wafer bonding using activated Si atomic layer of LiNbO3, glass, and sapphire
22天前
已完结
Glass-to-Glass Fusion Bonding Quality and Strength Evaluation with Time, Applied Force, and Heat
1个月前
已完结
线性离子源的综合设计和性能研究
1个月前
已完结
线性离子源的综合设计和性能研究
2个月前
已完结
Room temperature bonding of silicon and lithium niobate
2个月前
已完结
(Invited) Surface Activated Wafer Bonding; Principle and Current Status
3个月前
已关闭
Effects of Geometry and Surface Flatness on Direct Wafer Bonding by Multiphysics Modeling
3个月前
已完结
皖公网安备34019202002308
