| 标题 |
Improvement of the crystallinity of electroplated copper thin films for highly reliable 3D interconnections |
| 网址 | |
| DOI | |
| 其它 |
期刊:2014 IEEE 64th Electronic Components and Technology Conference (ECTC) 作者:Chuanhong Fan; Osamu Asai; Ryosuke Furuya; Ken Suzuki; Hideo Miura 出版日期:2014-05-01 |
| 求助人 | |
| 下载 |
PDF的下载单位、IP信息已删除
(2025-6-4)