| 标题 |
Polarity effect of interfacial intermetallic compounds of BGA structure Cu/Sn–52In/Cu solder joints during electromigration |
| 网址 | |
| DOI | |
| 其它 |
期刊:Intermetallics (Barking) 作者:Jiaqiang Huang; Yunhui Zhu; Kunhong Pan; Xudong Wang; Zhaoling Huang; et al 出版日期:2024-05-01 |
| 求助人 | |
| 下载 |
PDF的下载单位、IP信息已删除
(2025-6-4)