Lv1
78 积分 2025-08-04 加入
The formation of intermetallics in Cu/In thin films
6天前
已完结
Microstructure and mechanical property of Cu/In–45Cu/Ni solder joints formed by transient liquid phase bonding
8天前
已完结
Laminar Metal Foam: A Soft and Highly Thermally Conductive Thermal Interface Material with a Reliable Joint for Semiconductor Packaging
8天前
已完结
Semiconductor Joining by the Solid-Liquid-Interdiffusion (SLID) Process
1个月前
已完结
Lattice parameters, densities, expansion coefficients and perfection of structure of Cu and of Cu–In α phase
1个月前
已完结
Effect of Ni3Sn4 on the Thermo-Mechanical Fatigue Life of Solder Joints in 3D IC
1个月前
已完结
Electromigration Behavior of Sn-3.5Ag Solder Joints with (110) and (111) Nanotwinned Cu UBMs
1个月前
已关闭
Investigation on electromigration failure behavior of SAC305/SnPb micro-hybrid solder joints for package-on-package techniques: Experiment and simulation
1个月前
已完结
Polarity effect of interfacial intermetallic compounds of BGA structure Cu/Sn–52In/Cu solder joints during electromigration
2个月前
已完结
Thermal gradient-induced full intermetallic joints formation for chip bonding
2个月前
已完结
皖公网安备34019202002308
