| 标题 |
Thermal management of power electronics with liquid cooled metal foam heat sink |
| 网址 | |
| DOI | |
| 其它 |
期刊:International Journal of Thermal Sciences 作者:Yongtong Li; Liang Gong; Bin Ding; Minghai Xu; Yogendra Joshi 出版日期:2021-01-18 |
| 求助人 | |
| 下载 |
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(2025-6-4)