| 标题 |
Mechanical Reliability of SiCN – Ultra Low k Dielectrics in BEOL Interconnect Depending on Fracture Mode |
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| 其它 |
期刊:2025 20th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) 作者:Yeong Seok Ham; Min Sang Ju; Si Hyuk Sung; Myoung Song; Suhyun Bark; et al 出版日期:2025-12-17 |
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(2025-6-4)