| 标题 |
A Micro-alloying Strategy for Enhancing Bond Wire Reliability in IGBT Modules: Performance of Cu-Zn-Si versus Conventional Copper Wires |
| 网址 | |
| DOI | |
| 其它 |
期刊:Journal of Electronic Materials 作者:Yi-An Chan; Bo‐Chin Huang; Fei‐Yi Hung 出版日期:2025-12-16 |
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(2025-6-4)