| 标题 |
3D interconnected structure of poly(methyl methacrylate) microbeads coated with copper nanoparticles for highly thermal conductive epoxy composites |
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| DOI | |
| 其它 |
期刊:Composites Part B: Engineering 作者:Minh Canh Vu; Quang-Vu Bach; Dinh Duc Nguyen; Tuan Sang Tran; Marjan Goodarzi 出版日期:2019-10-01 |
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(2025-6-4)