| 标题 |
Effect of Creep, Fatigue and Random Vibration on the Integrity of Solder Joints in BGA Package |
| 网址 | |
| DOI | |
| 其它 |
期刊:Microelectronics Reliability 作者:Joshua A. Depiver; Sabuj Mallik; Emeka H. Amalu 出版日期:2024-05-05 |
| 求助人 | |
| 下载 |
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(2025-6-4)