| 标题 |
Microled-Based Opto-Electronic Co-Packaging for Chip-to-Chip Communications |
| 网址 | |
| DOI |
10.37665/watkchj44579
doi
|
| 其它 |
期刊:Wafer-Level Packaging Symposium 作者:Max Min; Drew Hallman-Osinski; Chris Pfistner; Bardia Pezeshki; Alex Tselikov; et al 出版日期:2022-02-01 |
| 求助人 | |
| 下载 |
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(2025-6-4)