| 标题 |
Effects of aging time in hydrogen peroxide-glycine-based Cu CMP slurry |
| 网址 | |
| DOI | |
| 其它 |
期刊:Materials Science in Semiconductor Processing 作者:Juhwan Kim; Donggeon Kwak; Jungjae Park; Takayuki Kubota; Taesung Kim 出版日期:2022-03-01 |
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(2025-6-4)