| 标题 |
Application of metal interconnection process with micro-LED display by laser-assisted bonding technology |
| 网址 | |
| DOI | |
| 其它 |
期刊:Journal of Materials Science: Materials in Electronics 作者:Wenya Tian; Zehao Ma; Binh Xuan Cao; Jia‐Hua Lin; Yongxin Cui; et al 出版日期:2023-12-01 |
| 求助人 | |
| 下载 | 求助已完成,仅限求助人下载。 |
PDF的下载单位、IP信息已删除
(2025-6-4)