| 标题 |
Gradient-Driven Multi-Scale Modeling for Coupled Thermal–Mechanical Optimization of Copper– Diamond Composites in High-Power Electronics Packaging |
| 网址 | |
| DOI | |
| 其它 |
期刊:2025 26th International Conference on Electronic Packaging Technology (ICEPT) 作者:Taolun Yang; Hu He 出版日期:2025-09-18 |
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(2025-6-4)