| 标题 |
Investigation of isothermal aged Sn-3Ag-0.5Cu/Sn58Bi-Co hybrid solder joints on ENIG and ENEPIG substrate with various mechanical performances |
| 网址 | |
| DOI | |
| 其它 |
期刊:Materials Today Communications 作者:Shuai Zhang; Qingyang Qiu; Tianran Ding; W. Long; Sujuan Zhong; et al 出版日期:2024-06-01 |
| 求助人 | |
| 下载 |
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(2025-6-4)