| 标题 |
An Efficient Junction Temperature Prediction Model for Diamond-on-Chip-on-Glass (DoCoG) Packaging Based on Thermal Resistance Network |
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| DOI | |
| 其它 |
期刊:IEEE Transactions on Components, Packaging and Manufacturing Technology 作者:Chenghao Bei; Tian Yu; Minghao Zhou; Shuchao Bao; Yuqi Su; et al 出版日期:2026-05-26 |
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(2025-6-4)