| 标题 |
Degradation of adhesion between Cu and epoxy-based dielectric during exposure to hot humid environments |
| 网址 | |
| DOI | |
| 其它 |
期刊:Microelectronics Reliability 作者:Key-one Ahn; Se-Hoon Park; Young-Ho Kim 出版日期:2017-11-01 |
| 求助人 | |
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(2025-6-4)