| 标题 |
Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-Three-Dimensional Manifold Coolers—Part 2: Parametric Study of EMMCs for High Heat Flux (∼1 kW/cm2) Power Electronics Cooling |
| 网址 | |
| DOI |
10.1115/1.4047883
doi
|
| 其它 |
期刊:Journal of Electronic Packaging 作者:Ki Wook Jung; Sougata Hazra; Heungdong Kwon; Alisha Piazza; Edward Jih; et al 出版日期:2020-07-22 |
| 求助人 | |
| 下载 | 求助已完成,仅限求助人下载。 |
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(2025-6-4)