Lv4
408 积分 2024-09-01 加入
Themo-hydraulic characteristics in geometrically modified manifold microchannel heat sinks: A numerical investigation
27天前
已完结
Enhanced performance of Ku-band GaN MMIC PA through embedded microfluidic cooling
27天前
已完结
Computational Fluid Dynamics Modeling and Optimization of Large-Scale (3 CM × 3 CM) Silicon-Based Embedded Microchannels With Three-Dimensional Manifold Microcoolers
27天前
已完结
Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-Three-Dimensional Manifold Coolers—Part 2: Parametric Study of EMMCs for High Heat Flux (∼1 kW/cm2) Power Electronics Cooling
27天前
已完结
Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-3D Manifold Coolers (EMMCs): Part 1—Experimental Study of Single-Phase Cooling Performance With R-245fa
27天前
已完结
A study on flow and heat transfer characteristics of manifold microchannels based on lattice Boltzmann method
28天前
已完结
An innovative manifold microchannel heat sink for thermal management of high-power chips with multiple hotspots
1个月前
已完结
Point-Contact Bonding of Integrated Three-Dimensional Manifold Microchannel Cooling Within Direct Bonded Copper Platform
1个月前
已完结
Investigation of Manifold Microchannel Cooler for High-Heat-Flux Electronic Cooling of 1000 W/cm2 with Varying Manifold and Microchannel Height
2个月前
已完结
Water Miscibility, Surface Tension, Density, and Dynamic Viscosity of Hydrophobic Deep Eutectic Solvents Composed of Capric Acid, Menthol, and Thymol
5个月前
已完结
皖公网安备34019202002308
