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550 积分 2024-09-01 加入
An innovative manifold microchannel heat sink for thermal management of high-power chips with multiple hotspots
1天前
已完结
Point-Contact Bonding of Integrated Three-Dimensional Manifold Microchannel Cooling Within Direct Bonded Copper Platform
2天前
已完结
Investigation of Manifold Microchannel Cooler for High-Heat-Flux Electronic Cooling of 1000 W/cm2 with Varying Manifold and Microchannel Height
26天前
已完结
Water Miscibility, Surface Tension, Density, and Dynamic Viscosity of Hydrophobic Deep Eutectic Solvents Composed of Capric Acid, Menthol, and Thymol
4个月前
已完结
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