| 标题 |
Elimination of polyimide stress buffer on integrated circuits using advanced packaging materials |
| 网址 | |
| DOI | |
| 其它 |
期刊:27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium 作者:D. Patten; J. Phou 出版日期:暂无 |
| 求助人 | |
| 下载 |
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(2025-6-4)