| 标题 |
Thermomechanical reliability assessment of large organic flip-chip ball grid array packages |
| 网址 | |
| DOI | |
| 其它 |
期刊:1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) 作者:M.F. Sylvester; D.R. Banks; R.L. Kern; R.G. Pofahl 出版日期:2002-11-27 |
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