| 标题 |
Low-temperature copper sinter-joining technology for next-generation electronics |
| 网址 | |
| DOI | |
| 其它 |
期刊:2026 International Conference on Electronics Packaging and Hybrid Bonding Symposium (ICEP-HBS) 作者:Xinyi Shi; Ningxi Zhang; Yujian Wang; Wanli Li 出版日期:2026 |
| 求助人 | |
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(2025-6-4)