| 标题 |
Overcoming the resistivity-roughness trade-off in 3D DRAM interconnects via nucleation-modulated atomic layer deposition |
| 网址 | |
| DOI | |
| 其它 |
期刊:Japanese Journal of Applied Physics 作者:Weidu Qin; Jiabao Sun; yayuan qin; shanshan ding; baodong han; et al 出版日期:2026 |
| 求助人 | |
| 下载 |
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(2025-6-4)