| 标题 |
Thermally conductive and electrically insulative alumina/epoxy composites for advanced electronic packaging applications: A comprehensive review of filler morphologies and surface modifications |
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| DOI | |
| 其它 |
期刊:Materials Today 作者:Zihao Lin; Zhijian Sun; Wenbin Fu; Yu-Chieh Lin; Kyoung‐sik Moon; et al 出版日期:2025-03-30 |
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(2025-6-4)