| 标题 |
Characterization of Commercial Epoxy Molding Compounds (EMCs) with High Thermal Conductivity |
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| DOI | |
| 其它 |
期刊:2024 IEEE 26th Electronics Packaging Technology Conference (EPTC) 作者:Yosephine Andriani; Harry Sax; Yong Khai Seen; Stefan Schwab; Richard Liu 出版日期:2024 |
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(2025-6-4)