| 标题 |
Significant enhancement in stability of copper nanowires network deposited by alumina via atomic layer deposition for transparent electromagnetic interference shielding |
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| 其它 |
期刊:2022 23rd International Conference on Electronic Packaging Technology (ICEPT) 作者:Kuifu Cheng; Xianwen Liang; Tao Zhao; Dan Liu; Zhiqiang Lai; et al 出版日期:2022 |
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(2025-6-4)