| 标题 |
High-Density, Energy-Efficient CPO Platform with PIC-in-Mold Interposer Architecture for AI/ML Data Centers |
| 网址 | |
| DOI | |
| 其它 |
期刊:2026 IEEE 76th Electronic Components and Technology Conference (ECTC) 作者:Sajay Bhuvanendran Nair Gourikutty; Wu Jiaqi; Zhonghua Yang; Mihai Rotaru; Ji Lin; et al 出版日期:2026-05-26 |
| 求助人 | |
| 下载 | 该求助完结已超 24 小时,文件已从服务器自动删除,无法下载。 |
PDF的下载单位、IP信息已删除
(2025-6-4)