| 标题 |
Microstructure and mechanical properties of Si3N4/Cu joints brazed using CuSnTi and In-alloyed CuSnTi active brazing fillers in vacuum |
| 网址 | |
| DOI | |
| 其它 |
期刊:Journal of materials science. Materials in electronics 作者:Fu-Rui Xu; Lu-Tong Qie; Wei-Bing Guo; Zong-Yang Dou; Hai-Tao Xue; et al 出版日期:2026-06-01 |
| 求助人 | |
| 下载 | 求助已完成,仅限求助人或该文件上传人下载。 |
PDF的下载单位、IP信息已删除
(2025-6-4)