| 标题 |
Solder Bump Joint Failure Investigation: From Sample Preparation to Advanced Structural Characterizations and Strain Measurements |
| 网址 | |
| DOI |
10.31399/asm.cp.istfa2019p0043
doi
|
| 其它 |
期刊:International Symposium for Testing and Failure Analysis 作者:Pawel Nowakowski; Mary Ray; Paul Fischione 出版日期:2019-12-01 |
| 求助人 | |
| 下载 | 暂无链接,等待应助者上传 |
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(2025-6-4)