| 标题 |
An interpolation-based transient solidification conditions model for numerical calculation of grain growth during laser welding |
| 网址 | |
| DOI | |
| 其它 |
期刊:Thermal Science and Engineering Progress 作者:Yuewei Ai; Shibo Han; Yachao Yan 出版日期:2024-01-01 |
| 求助人 | |
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(2025-6-4)