| 标题 |
Temperature profile effects in accelerated thermal cycling of SnPb and Pb-free solder joints |
| 网址 | |
| DOI | |
| 其它 |
期刊:Microelectronics Reliability 作者:Yan Qi; Rex Lam; Hamid R. Ghorbani; Polina Snugovsky; Jan K. Spelt 出版日期:2005-03-16 |
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(2025-6-4)