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40 积分 2025-04-11 加入
Thermal-Mechanical Property of High Aspect Ratio TSV in Advanced IC integration and Packaging
9小时前
待确认
MORE-Stress: Model Order Reduction based Efficient Numerical Algorithm for Thermal Stress Simulation of TSV Arrays in 2.5D/3D IC
9小时前
已完结
射频微系统集成技术
21天前
已完结
A Review on the Fabrication and Reliability of Three-Dimensional Integration Technologies for Microelectronic Packaging: Through-Si-via and Solder Bumping Process
30天前
已完结
Microsystems using three-dimensional integration and TSV technologies: Fundamentals and applications
30天前
已完结
基于玻璃通孔互连技术的集成无源器件发展
1个月前
已完结
Recent Developments in Thermal Management of 3D ICs: A Review
1个月前
已完结
Effect of Cu Microstructures on Cu/SiO2 Hybrid Bonding for 3D IC Heterogeneous Integration
1个月前
已完结
Thermal management materials for 3D-stacked integrated circuits
1个月前
已完结
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