| 标题 |
Machine learning assisted multiphysics simulation for electroplating copper in high aspect ratio through silicon via |
| 网址 | |
| DOI | |
| 其它 |
期刊:Electrochimica Acta 作者:Xiaoyue Ding; Wei Li; Yang Xi; Hanwen Cui; Zhaotian Li; et al 出版日期:2026-02-17 |
| 求助人 | |
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(2025-6-4)