| 标题 |
Study on the interface interaction between the chip backside metallization and solder alloys of power semiconductor modules |
| 网址 | |
| DOI | |
| 其它 |
期刊:Journal of Materials Science: Materials in Electronics 作者:Shilin Zhao; Erxian Yao; Chunbiao Wang; Yan Tong 出版日期:2025-09-01 |
| 求助人 | |
| 下载 |
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(2025-6-4)