The effect of multi-field coupling on dynamic recrystallization behavior in IN718 alloy

The dynamic recrystallization behavior of IN718 alloy is studied under multi-field coupling based on deformation difficulty at high temperature. The results show that dynamic recrystallization of IN718 alloy occur at 750°C under multi-field. At the same temperature, the resistance of IN718 alloy decreases and the degree of dynamic recrystallization increases with the increase of pulse current frequency. The dynamic recrystallization mechanism of alloy under multi-field coupling is discontinuous mechanism of grain boundary arch nucleation. The dynamic recrystallization ability is significantly improved under the action of multi-field coupling, thus the deformation resistance is reduced. The reason is that the dislocation movement intensifies under the action of multi-field coupling, which promotes dislocation proliferation and recovery, and then promotes dynamic recrystallization.