聚酰亚胺
材料科学
共聚物
聚苯乙烯
润湿
接触角
多孔性
电介质
高分子化学
化学工程
溶剂
纳米技术
复合材料
聚合物
图层(电子)
化学
有机化学
工程类
光电子学
作者
Mengwei Huo,Yibo Wang,Xinbo Wang
出处
期刊:Polymers
[MDPI AG]
日期:2023-01-26
卷期号:15 (3): 635-635
被引量:1
标识
DOI:10.3390/polym15030635
摘要
Ordered porous polyimide films were fabricated from (AB)m type of diblock copolymer polyimide-b-polystyrene (PI-b-PS). An increase in PS volume fraction (f VPS) is beneficial to decrease the relative dielectric constants and water contact angles of the obtained porous PI films: the relative dielectric constant decreases to 1.89 and water contact angle decreases to 43° when f VPS is 0.36, indicating porous PI films can be used as low-κ material and have good wettability. The solvent uptake of the porous PI films increases with increasing f VPS. A net-like morphology appears when f VPS reaches 0.36. The net-like porous PI film reaches equilibrium uptake of water within approximately 2.5 h, with a final equilibrium uptake ratio of 17.5%, and reaches equilibrium uptake of toluene within approximately 8 h, with a final equilibrium uptake ratio of 15.4%, displaying the highest and fastest solvent uptake compared with other microstructured porous PI films, which is ascribed to the specific characteristic of the interconnecting porous channels derived from the self-assembly of PI-b-PS with f VPS 0.36. Introducing thermally degradable segments to PI-based block copolymer is an effective method to prepare porous PI films and can enhance some of their properties.
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