In situ growth and shrinkage of coated voids in aluminium

Voids can be detrimental to the mechanical and electrical properties of materials but may also find applications in catalysis and plasmonics. Key to the performance of materials containing voids are the sizes and morphologies of the voids, which can be tuned by heat treatment. The present work investigates the morphological evolution of voids, with solute segregation at their surfaces, in an aluminium‑copper‑tin alloy during in situ heating in a transmission electron microscope (TEM). These voids exhibited complex morphological changes that included growth or shrinkage, in contrast to voids in pure Al, which all shrunk and disappeared (as reported in an earlier study). Without electron irradiation, the voids never grew. Nearly one fourth of the voids grew under certain heating and electron irradiation conditions, showing distinct growth stages. Growth and shrinkage of the voids both occurred primarily along the surface of the Sn particles to which they were attached. The voids exhibited faceting as they grew and gained morphological isotropy while they shrank. The growth and shrinkage fronts were both found to be primarily the curved surfaces and not the facets at the void surfaces. Growth followed by shrinkage led to a well-defined rounded triangular shape, in projection, with smooth boundaries. This work is, to the best of our knowledge, the first to characterise the growth of nanoscale voids in aluminium using in situ heating TEM. The dual effect of heating and electron irradiation could be utilised to switch the voids between growth and shrinkage to manipulate the void size and shape. This work provides useful insights into tuning void morphologies in the development of advanced materials such as for applications in engineering, catalysis and plasmonics.