Memory SEU simulations using 2-D transport calculations
作者
J.S. Fu,Carl L. Axness,Harry T. Weaver
出处
期刊:IEEE Electron Device Letters [Institute of Electrical and Electronics Engineers] 日期:1985-08-01卷期号:6 (8): 422-424被引量:44
标识
DOI:10.1109/edl.1985.26177
摘要
An advance in the simulation of a single event upset (SEU) of a static memory is achieved by combining transport and circuit effects in a single calculation. The program SIFCOD [4] is applied to the four transistors of a CMOS SRAM cell to determine its transient circuit response following a very high energy ion hit. Results unique to this type of calculation include determination of relative upset sensitivites and different upset mechanisms for specific area hits, i.e., the OFF p-channel drain, the OFF or ON n-channel drain, etc. The calculation determines the transport variables as a function of time in two-space dimensions for each of the four transistors and provides the nodal voltage and current responses for assessing memory upset conditions.