New electrically conductive adhesives (ECAs) for flexible interconnect applications

By blending flexible epoxy with rigid epoxy or using epoxies with different chain lengths, the mechanical properties of the resulting polymer matrices could be tuned to meet different requirements. With the introduction of nanoparticles into the formulation, better electrical properties of the resulting flexible ECAs (FECAs) have been achieved via particle-particle interface enhancement. Moreover, adhesion strength of FECAs on a Au surface has been significantly improved by using conjugated difunctional molecules. With optimized material properties of FECAs, device level test indicated that the FECAs can be used for flexible electronics. In addition, conductive thin films with certain transparency have been developed using Ag-coated glass fiber as filler.