材料科学
聚醚酰亚胺
复合材料
复合数
氮化硼
热导率
电介质
微电子
纳米颗粒
磁性纳米粒子
聚合物
纳米技术
光电子学
作者
Wenhao Luo,Canfeng Wu,Liangjie Li,Tingting Jia,Shuhui Yu,Yingbang Yao
标识
DOI:10.1016/j.jallcom.2022.165248
摘要
In this study, hexagonal boron nitride (h-BN) - polyetherimide (PEI) composites were prepared by a simple solution casting method, where the h-BN particles were aligned by an external magnetic field. Prior to the preparation of the composite samples, the h-BN platelets were firstly decorated by iron oxide nanoparticles (Fe3O4) to achieve the desired magnetic properties. Due to the alignment of h-BN particles, the composite exhibited greatly enhanced thermal conductivity along that direction. At a filler loading of 20 wt%, an enhancement of 166% was obtained, compared to that of the unaligned composite. Furthermore, the composite samples showed a low dielectric loss (~ 0.01) with the filling ratio below 20 wt% and a tensile modulus of up to 2.34 GPa. Bearing such thermal conductivity, electrical insulation properties, and mechanical properties, these composites with magnetically aligned h-BN particles show potentials for microelectronic packaging applications.
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