Recent Progress of Anti-adhesion Performance in Nanoimprint Lithography

Nanoimprint lithography(NIL) is an excellent lithographic technique due to its high throughput and high resolution.But the adhesion during the demolding significantly limits the accurate transfer of patterns,thus how to overcome the anti-adhesion is very critical in NIL.The Fluorinated self-assembled monolayer(F-SAM) has been widely used as an effective anti-adhesion layer on the mold.Reviews and analysis are carried out about recent studies on the heat durability and degradation of F-SAMs.Meanwhile,other new approaches to reduce the adhesion have also been introduced,including the utilization of diamond-like carbon(DLC),release-agent spray-coated resists,and fluorinated surfactant additives.Weaknesses of these methods are analyzed and the developing trend of the anti-adhesion in NIL has been introduced.