Bonding strength between plating and matrix is an essential index to decide whether the functional layers can be actually used. As a new substitute of hard Cr plating, the bonding strength of Ni-Fe-W-P alloy plating was studied contrasting with hard Cr plating by means of static and dynamic loading. The results show that the Ni-Fe-W-P alloy plating has excellent bonding strength under impacting, fatigue and several composite loads, which is because diffuse layer exists between plating and matrix and forms tough alloy. The diffuse layer reduces the distinction of crystal lattice between surface plating and matrix, and the mechanical rivet has some effect. Rational process conditions can be result in alloy plating with high bonding strength. The experimental results also show that bonding strength of Ni-Fe-W-P alloy plating layer is better than that of hard Cr plating.